The microelectronic wire bond pull test—How to use it, how to abuse it : George G. Harman and Cynthia A. Cannon. IEEE Trans. Components, Hybrids, Mfg Technol. Chmt-1, (3) p. 203 (September 1978)

• Publisher: Elsevier Science
• Year: 1979
• Tongue: English
• Weight: 209 KB
• Volume: 19
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(79)90172-0