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Nickel–palladium bond pads for copper wire bonding

✍ Scribed by Horst Clauberg; Petra Backus; Bob Chylak

Book ID: 104056434
Publisher: Elsevier Science
Year: 2011
Tongue: English
Weight: 615 KB
Volume: 51
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2010.05.001

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