Surface treatment of wire bonding metal
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S. Alberici; D. Coulon; P. Joubin; Y. Mignot; L. Oggioni; P. Petruzza; D. Piumi;
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Article
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2003
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Elsevier Science
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English
β 686 KB
The random formation of micrometric crystals on Al bonding pads can be an issue affecting wire bonding metal pad quality. The dry etch chemistry used to remove final passivation dielectric layers from the top of the bonding Al pad area is in fact based mainly on fluorine-containing gases (such as CF