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Nanomechanical properties of copper thin films on different substrates using the nanoindentation technique

✍ Scribed by Te-Hua Fang; Win-Jin Chang

Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
274 KB
Volume
65
Category
Article
ISSN
0167-9317

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πŸ“œ SIMILAR VOLUMES

Effects of the substrate on the determin
Effects of the substrate on the determination of thin film mechanical properties by nanoindentation
✍ Ranjana Saha; William D. Nix πŸ“‚ Article πŸ“… 2002 πŸ› Elsevier Science 🌐 English βš– 511 KB

We examine the effects of the substrate on the determination of mechanical properties of thin films by nanoindentation. The properties of aluminum and tungsten films on the following substrates have been studied: aluminum, glass, silicon and sapphire. By studying both soft films on hard substrates a

Molecular Dynamics Simulation on the Nan
Molecular Dynamics Simulation on the Nanoindentation Behavior of a Copper Bilayered Thin Film
✍ Ming-Liang LIAO; Meng-Hsiung WENG; Shin-Pon JU; Hsing-Jung CHIANG πŸ“‚ Article πŸ“… 2008 πŸ› Elsevier Science βš– 764 KB

Understanding the mechanical properties of multilayered metal thin films is very important for their applications in nanoscale devices. Nanoindentation is one of the widely used tools for examining the mechanical properties of metal thin films. In the present study, molecular dynamics simulation was