✦ LIBER ✦

Multichip packaging technology with laser-patterned interconnects

✍ Scribed by Barfknecht, A.T.; Tuckerman, D.B.; Kaschmitter, J.L.; McWilliams, B.M.

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Multichip packaging technology with lase

📂 Article 📅 1990 🏛 Elsevier Science 🌐 English ⚖ 60 KB

Evaluation of polyimides as dielectric m

✍ Lin, A.W. 📂 Article 📅 1990 🏛 IEEE 🌐 English ⚖ 596 KB

Multichip free-space global optical inte

✍ Haney, Michael W. ;Christensen, Marc P. ;Milojkovic, Predrag ;Ekman, Jeremy ;Cha 📂 Article 📅 1999 🏛 The Optical Society 🌐 English ⚖ 795 KB

Evaluation of polyimides as dielectric m

📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 120 KB

[IEEE Thirteenth IEEE/CHMT International

✍ Charles, H.K. 📂 Article 📅 1992 🏛 IEEE ⚖ 678 KB

Terahertz Technology: Photonic Crystal T

✍ Chassagneux, Y.; Colombelli, R.; Maineult, W.; Barbieri, S.; Beere, H.E.; Ritchi 📂 Article 📅 2009 🏛 Optical Society of America 🌐 English ⚖ 91 KB