✦ LIBER ✦
Multichip packaging technology with laser-patterned interconnects : Andrew T. Barfknecht, David B. Tuckerman, James L. Kaschmitter and Bruce M. McWilliams. IEEE Trans. Compon. Hybrids mfg Technol.12(4), 646 (1989)
- Book ID
- 103284803
- Publisher
- Elsevier Science
- Year
- 1990
- Tongue
- English
- Weight
- 60 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0026-2714
No coin nor oath required. For personal study only.