✦ LIBER ✦
Evaluation of polyimides as dielectric materials for multichip packages with multilevel interconnection structure : A. W. Lin. IEEE Trans. Compon. Hybrids mfg Technol. 13(1), 207 (1990)
- Publisher
- Elsevier Science
- Year
- 1991
- Tongue
- English
- Weight
- 120 KB
- Volume
- 31
- Category
- Article
- ISSN
- 0026-2714
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