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Evaluation of polyimides as dielectric materials for multichip packages with multilevel interconnection structure

✍ Scribed by Lin, A.W.

Book ID: 117872704
Publisher: IEEE
Year: 1990
Tongue: English
Weight: 596 KB
Volume: 13
Category: Article
ISSN: 0148-6411
DOI: 10.1109/33.52872

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