Modification of “SPICE” for simulation of coupled packaging interconnections : Dongjin Lee and O. A. Palusinski. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(4), 491 (1992)

• Publisher: Elsevier Science
• Year: 1993
• Tongue: English
• Weight: 215 KB
• Volume: 33
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(93)90448-8