✦ LIBER ✦
Overview of packaging for the IBM enterprise system/9000 based on the glass-ceramic copper/thin film thermal conduction module : Rao R. Tummala and Shakil Ahmed. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(4), 426 (1992)
- Publisher
- Elsevier Science
- Year
- 1993
- Tongue
- English
- Weight
- 108 KB
- Volume
- 33
- Category
- Article
- ISSN
- 0026-2714
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