𝔖 Bobbio Scriptorium

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The simulation of high-speed, high-density digital interconnects in single chip packages and multichip modules : Guang-Wen Pan et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(4), 465 (1992)

Publisher: Elsevier Science
Year: 1993
Tongue: English
Weight: 112 KB
Volume: 33
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(93)90436-3

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