Packaging of high-density fiber/laser modules using passive alignment techniques : Mitchell S. Cohen et al. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(6), 944 (1992)

• Publisher: Elsevier Science
• Year: 1994
• Tongue: English
• Weight: 87 KB
• Volume: 34
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(94)90279-8