Development and analysis of an automated test system for the thermal characterization of IC packaging technologies : Sean Cian O. Mathuna. IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15(5), 615 (1992)

• Publisher: Elsevier Science
• Year: 1993
• Tongue: English
• Weight: 111 KB
• Volume: 33
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(93)90446-6