Nanoporous silica aerogels are promising candidates for ultra-low-k dielectrics used in the metallization system of the 0.13 mm IC generation and beyond. In this paper the relation between dielectric constant and microstructure is investigated. Application of an electrostatic field solver to several
โฆ LIBER โฆ
Modelling and simulation for dielectric constant of aerogel
โ Scribed by Xia Xiao; Reinhard Streiter; Gang Ruan; Renru Song; Thomas Otto; Thomas Gessner
- Book ID
- 108411097
- Publisher
- Elsevier Science
- Year
- 2000
- Tongue
- English
- Weight
- 433 KB
- Volume
- 54
- Category
- Article
- ISSN
- 0167-9317
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The material and dielectric properties of SiO 2 aerogel thin films were studied. These films were fabricated by spin coating and a subsequent supercritical drying method. Film porosity was evaluated as 67% with Rutherford backscattering spectrometry and its dielectric constant was measured to be 2.1