Evaluation of SiO2 aerogel thin film with ultra low dielectric constant as an intermetal dielectric

✍ Scribed by Moon-Ho Jo; Jung-Kyun Hong; Hyung-Ho Park; Joong-Jung Kim; Sang-Hun Hyun

• Publisher: Elsevier Science
• Year: 1997
• Tongue: English
• Weight: 316 KB
• Volume: 33
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/s0167-9317(96)00063-9

✦ Synopsis

The material and dielectric properties of SiO 2 aerogel thin films were studied. These films were fabricated by spin coating and a subsequent supercritical drying method. Film porosity was evaluated as 67% with Rutherford backscattering spectrometry and its dielectric constant was measured to be 2.15 using metal/insulator/semiconductor structure. Dielectric constant of SiO 2 aerogel was sensitive to the surface coverage and we could obtain a lower dielectric constant, 2.07 with thermal dehydration at 450°C. This value was one of the lowest among intermetal dielectric materials ever reported.