We have investigated the dynamics of intrinsic dielectric breakdown (BD) in SiO thin films of thickness in the range 2 from 35 to 3 nm. BD is obtained under constant voltage Fowler-Nordheim stress at fields between 10 and 12.5 MV/ cm. As a function of oxide thickness we have followed with high time
Modeling the breakdown and breakdown statistics of ultra-thin SiO2 gate oxides
✍ Scribed by Jordi Suñé; Ernest Wu
- Publisher
- Elsevier Science
- Year
- 2001
- Tongue
- English
- Weight
- 101 KB
- Volume
- 59
- Category
- Article
- ISSN
- 0167-9317
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✦ Synopsis
A complete picture of breakdown is presented and compared with a full set of experiments. First, an analytical model for the breakdown statistics is proposed. This model is shown to have essentially the same predictive power as the percolation approach. Second, a hydrogen-based quantitative picture for the defect generation process is presented. A two-step mechanism consisting in the release of protons from suboxide bonds at the anode interface and the subsequent reaction with oxygen vacancies is considered. A kinetic approach is followed to demonstrate the requirement of a parallel combination of the rates corresponding to these two processes. The model is successfully compared with a complete set of breakdown measurements.
📜 SIMILAR VOLUMES
Time±resolved electrical measurements show transient phenomena occurring during degradation and intrinsic dielectric breakdown of gate oxide layers under constant voltage Fowler±Nordheim stress. We have studied such transients in metal/oxide/semiconductor (MOS) capacitors with an n + poly-crystallin