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Modeling electromigration and the void nucleation in thin-film interconnects of integrated circuits

✍ Scribed by R.V. Goldstein; M.E. Sarychev; D.B. Shirabaikin; A.S. Vladimirov; Yu.V. Zhitnikov

Book ID: 110296711
Publisher: Springer Netherlands
Year: 2001
Tongue: English
Weight: 515 KB
Volume: 109
Category: Article
ISSN: 1573-2673
DOI: 10.1023/a:1011024712116

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