The excess noise in integrated circuit interconnects before and after electromigration damage

✍ Scribed by Jianping Guo; B.K Jones; G Trefan

• Book ID: 108362459
• Publisher: Elsevier Science
• Year: 1999
• Tongue: English
• Weight: 238 KB
• Volume: 39
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/s0026-2714(99)00172-9