✦ LIBER ✦

Time dependence of stress and hillock distributions during electromigration in thin metal film interconnections

✍ Scribed by L. Klinger; E. Glickman; A. Katsman; L. Levin

Publisher: Elsevier Science
Year: 1994
Tongue: English
Weight: 366 KB
Volume: 23
Category: Article
ISSN: 0921-5107
DOI: 10.1016/0921-5107(94)90271-2

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