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Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints

โœ Scribed by Y. W. Chang; S. H. Chiu; Chih Chen


Book ID
107457035
Publisher
Springer US
Year
2010
Tongue
English
Weight
665 KB
Volume
39
Category
Article
ISSN
0361-5235

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