Investigation of Void Nucleation and Propagation in the Joule Heating Effect During Electromigration in Flip-Chip Solder Joints

✍ Scribed by Y. W. Chang; S. H. Chiu; Chih Chen

• Book ID: 107457035
• Publisher: Springer US
• Year: 2010
• Tongue: English
• Weight: 665 KB
• Volume: 39
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-010-1361-7