✦ LIBER ✦
Effect of Migration and Condensation of Pre-existing Voids on Increase in Bump Resistance of Flip Chips on Flexible Substrates during Electromigration
✍ Scribed by S.W. Liang; Y.W. Chang; Chih Chen; Jackie Preciado; K.N. Tu
- Book ID
- 107455191
- Publisher
- Springer US
- Year
- 2008
- Tongue
- English
- Weight
- 355 KB
- Volume
- 37
- Category
- Article
- ISSN
- 0361-5235
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