𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Microstructure and mechanical properties of an Si3N4/Si3N4 joint brazed with Au–Ni–Pd–V filler alloy

✍ Scribed by Y. Sun; J. Zhang; Y.P. Geng; K. Ikeuchi; T. Shibayanagi


Book ID
113898785
Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
367 KB
Volume
64
Category
Article
ISSN
1359-6462

No coin nor oath required. For personal study only.


📜 SIMILAR VOLUMES


Effect of Ti content on microstructure a
✍ C.F. Liu; J. Zhang; Y. Zhou; Q.C. Meng; M. Naka 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 655 KB

A novel Cu-Pd-Ti filler alloy was adopted to braze silicon nitride ceramic to itself in the form of Cu/(Ti, Pd)/Cu. The reliable Si 3 N 4 joints were obtained. The effect of Ti content on the microstructure and properties of the Si 3 N 4 joints was investigated using EPMA, SEM and three-point bendin