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Interfacial microstructure of Si3N4/Si3N4 brazing joint with Cu–Zn–Ti filler alloy

✍ Scribed by J. Zhang; X.M. Zhang; Y. Zhou; M. Naka; Atroshenko Svetlana

Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
709 KB
Volume
495
Category
Article
ISSN
0921-5093

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✍ C.F. Liu; J. Zhang; Y. Zhou; Q.C. Meng; M. Naka 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 655 KB

A novel Cu-Pd-Ti filler alloy was adopted to braze silicon nitride ceramic to itself in the form of Cu/(Ti, Pd)/Cu. The reliable Si 3 N 4 joints were obtained. The effect of Ti content on the microstructure and properties of the Si 3 N 4 joints was investigated using EPMA, SEM and three-point bendin