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Interfacial microstructure of the Si3N4/Si3N4 joint brazed with Cu–Pd–Ti filler alloy

✍ Scribed by J. Zhang; Y. Zhou; M. Naka

Book ID
108170143
Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
859 KB
Volume
26
Category
Article
ISSN
0955-2219

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Effect of Ti content on microstructure and strength of Si3N4/Si3N4 joints brazed with Cu–Pd–Ti filler metals
✍ C.F. Liu; J. Zhang; Y. Zhou; Q.C. Meng; M. Naka 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 655 KB

A novel Cu-Pd-Ti filler alloy was adopted to braze silicon nitride ceramic to itself in the form of Cu/(Ti, Pd)/Cu. The reliable Si 3 N 4 joints were obtained. The effect of Ti content on the microstructure and properties of the Si 3 N 4 joints was investigated using EPMA, SEM and three-point bendin