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Interfacial microstructure of Si3N4/Si3N4joint brazed using Au–Ni–V filler alloy

✍ Scribed by J. Zhang; Y. Sun; C. F. Liu; H. W. Zhang

Publisher
Springer
Year
2009
Tongue
English
Weight
424 KB
Volume
45
Category
Article
ISSN
0022-2461

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A novel Cu-Pd-Ti filler alloy was adopted to braze silicon nitride ceramic to itself in the form of Cu/(Ti, Pd)/Cu. The reliable Si 3 N 4 joints were obtained. The effect of Ti content on the microstructure and properties of the Si 3 N 4 joints was investigated using EPMA, SEM and three-point bendin