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Microstructure and adhesion strength of Sn–9Zn–1.5Ag–xBi (x = 0 wt% and 2 wt%)/Cu after electrochemical polarization in a 3.5 wt% NaCl solution

✍ Scribed by Wang-Long Li; Ying-Ru Chen; Kuo-Ming Chang; Chih-Yao Liu; Min-Hsiung Hon; Moo-Chin Wang

No coin nor oath required. For personal study only.

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Microstructure and adhesion strength of Sn–9Zn–1.5Ag–xBi (x&#xa0;=&#xa0;0&#xa0;wt% and 2&#xa0;wt%)/Cu after electrochemical polarization in a 3.5&#xa0;wt% NaCl solution