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MeV He microbeam analysis of a semiconductor integrated circuit

โœ Scribed by Zhu Peiran; Liu Jiarui; Zhang Jinping; Yin Shiduan


Publisher
Elsevier Science
Year
1989
Tongue
English
Weight
184 KB
Volume
39
Category
Article
ISSN
0042-207X

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Chemorheology (and thus process modeling) of highly filled thermosets used in integrated circuit (IC) packaging has been complicated by their highly filled nature, fast kinetics of curing, and viscoelastic nature. This article summarizes a more thorough chemorheological analysis of a typical IC pack