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Mechanical processes in chemical-mechanical planarization: Plasticity effects in oxide thin films

✍ Scribed by Krishna Rajan


Book ID
107457746
Publisher
Springer US
Year
1998
Tongue
English
Weight
77 KB
Volume
27
Category
Article
ISSN
0361-5235

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The effects of polishing pressure and abrasive on the chemical mechanical polishing of blanket and patterned aluminum thin films were investigated. The CMP process experiments were conducted using a soft pad and slurry mainly composed of acid solution and Al O abrasive. The result of the blanket fil