Materials For Advanced Packaging
β Rajen Chanchani (auth.), Daniel Lu, C.P. Wong (eds.)
π Library
π
2009
π Springer US
π English
β¦ LIBER β¦
π
Materials for Advanced Packaging
β Scribed by Rajen Chanchani (auth.), Daniel Lu, C.P. Wong (eds.)
- Publisher
- Springer US
- Year
- 2009
- Tongue
- English
- Leaves
- 722
- Edition
- 1
- Category
- Library
β¬ Acquire This Volume
No coin nor oath required. For personal study only.
β¦ Synopsis
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. Materials for Advanced Packaging provides a comprehensive review on the most recent developments in advanced packaging technologies including emerging technologies such as 3 dimensional (3D), nanopackaging, and biomedical packaging with a focus on materials and processing aspects.
This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging including:
New bonding and joining techniques
Novel approaches to make electrical interconnects between integrated circuit (IC) and substrates
Latest advances in packaging materials such as lead-free solders, flip chip underfills, epoxy molding compounds, and conductive adhesives.
Materials and processing aspects on MEMS and wafer level chip scale packaging.
Written by experts in the field of materials and packaging, Materials for Advanced Packaging is a must have book for professionals in semiconductor, digital health and bio-medical areas, and graduate students studying materials science and engineering.
β¦ Table of Contents
Front Matter....Pages i-xii
3D Integration Technologies β An Overview....Pages 1-50
Advanced Bonding/Joining Techniques....Pages 51-76
Advanced Chip-to-Substrate Connections....Pages 77-112
Advanced Wire Bonding Technology: Materials, Methods, and Testing....Pages 113-179
Lead-Free Soldering....Pages 181-218
Thin Die Production....Pages 219-242
Advanced Substrates: A Materials and Processing Perspective....Pages 243-271
Advanced Print Circuit Board Materials....Pages 273-306
Flip-Chip Underfill: Materials, Process and Reliability....Pages 307-337
Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips....Pages 339-363
Electrically Conductive Adhesives (ECAs)....Pages 365-405
Die Attach Adhesives and Films....Pages 407-436
Thermal Interface Materials....Pages 437-458
Embedded Passives....Pages 459-502
Nanomaterials and Nanopackaging....Pages 503-545
Wafer Level Chip Scale Packaging....Pages 547-600
Microelectromechanical Systems and Packaging....Pages 601-627
LED and Optical Device Packaging and Materials....Pages 629-680
Digital Health and Bio-Medical Packaging....Pages 681-712
Back Matter....Pages 713-719
β¦ Subjects
Optical and Electronic Materials; Metallic Materials; Nanotechnology; Electronics and Microelectronics, Instrumentation
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