Materials For Advanced Packaging

✍ Scribed by Rajen Chanchani (auth.), Daniel Lu, C.P. Wong (eds.)

Publisher: Springer US
Year: 2009
Tongue: English
Leaves: 723
Edition: 1
Category: Library

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✦ Subjects

Optical and Electronic Materials; Metallic Materials; Nanotechnology; Electronics and Microelectronics, Instrumentation

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