Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous
Materials for Electronic Packaging
β Scribed by Deborah Chung
- Publisher
- Butterworth-Heinemann
- Year
- 1995
- Tongue
- English
- Leaves
- 383
- Category
- Library
No coin nor oath required. For personal study only.
π SIMILAR VOLUMES
<br> Content: Polymeric materials for electronics packaging and interconnection : an overview / John H. Lupinski and Robert S. Moore --<br/> Cure studies of PMDA-ODA- and BTDA-ODA-based polyimides by fluorescence spectroscopy / Eric D. Wachsman, Peter S. Martin, and Curtis W. Frank --<br/> Dynamic F
<p>The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industryβs ability to provide continued improvements in device and system performance. With increased performance requirements for smaller,
<span>Thermal Management Materials for Electronic Packaging</span><p><span>Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging</span></p><p><span>Thermal Management Materials for Ele