<br> Content: Polymeric materials for electronics packaging and interconnection : an overview / John H. Lupinski and Robert S. Moore --<br/> Cure studies of PMDA-ODA- and BTDA-ODA-based polyimides by fluorescence spectroscopy / Eric D. Wachsman, Peter S. Martin, and Curtis W. Frank --<br/> Dynamic F
Polymeric Materials for Electronics Packaging and Interconnection
โ Scribed by Lupinsky J.H., Moore R.S.
- Publisher
- ACS
- Year
- 1989
- Tongue
- English
- Leaves
- 490
- Series
- ACS Symposium Series 407
- Edition
- 1
- Category
- Library
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
<p><P>The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. </P><P><EM>Materials for Information Technology</EM> is an up-to-date overview of current developments and R&D activities in
The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of material
This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.
Although materials play a critical role in electronic packaging, the vast majority of attention has been given to the systems aspect. Materials for Electronic Packaging targets materials engineers and scientists by focusing on the materials perspective. The last few decades have seen tremendous