๐”– Scriptorium
โœฆ   LIBER   โœฆ

๐Ÿ“

Materials for Information Technology: Devices, Interconnects and Packaging (Engineering Materials and Processes)

โœ Scribed by Ehrenfried Zschech (Editor), Caroline Whelan (Editor), Thomas Mikolajick (Editor)


Publisher
Springer
Year
2005
Tongue
English
Leaves
490
Edition
1st Edition.
Category
Library

โฌ‡  Acquire This Volume

No coin nor oath required. For personal study only.

โœฆ Synopsis


This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.


๐Ÿ“œ SIMILAR VOLUMES


Materials for Information Technology: De
โœ A. Dimoulas (auth.), Ehrenfried Zschech, Caroline Whelan Ph.D., Thomas Mikolajic ๐Ÿ“‚ Library ๐Ÿ“… 2005 ๐Ÿ› Springer-Verlag London ๐ŸŒ English

<p><P>The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. </P><P><EM>Materials for Information Technology</EM> is an up-to-date overview of current developments and R&D activities in

Materials for Information Technology: De
โœ Ehrenfried Zschech ๐Ÿ“‚ Library ๐Ÿ“… 2005 ๐Ÿ› Springer Science & Business Media ๐ŸŒ English

The fast-developing information technology industry is driving a need for new materials in order to facilitate the development of more reliable microelectronic products. Materials for Information Technology is an up-to-date overview of current developments and R&D activities in the field of material

Polymeric Materials for Electronics Pack
โœ John H. Lupinski and Robert S. Moore (Eds.) ๐Ÿ“‚ Library ๐Ÿ“… 1989 ๐Ÿ› American Chemical Society ๐ŸŒ English

<br> Content: Polymeric materials for electronics packaging and interconnection : an overview / John H. Lupinski and Robert S. Moore --<br/> Cure studies of PMDA-ODA- and BTDA-ODA-based polyimides by fluorescence spectroscopy / Eric D. Wachsman, Peter S. Martin, and Curtis W. Frank --<br/> Dynamic F

Packaging technology: Fundamentals, mate
โœ Anne Emblem, Henry Emblem ๐Ÿ“‚ Library ๐Ÿ“… 2012 ๐Ÿ› Woodhead Publishing ๐ŸŒ English

This book thoroughly reviews the basics and more advanced concepts in packaging technology. Published in association with the Packaging Society in Britain, the book could be recommended reading for certification courses, such as those offered by Michigan State University School of Packaging,