Materials for Advanced Packaging

✍ Scribed by Daniel Lu, C.P. Wong (eds.)

• Publisher: Springer
• Year: 2016
• Tongue: English
• Leaves: 974
• Edition: 2
• Category: Library

✦ Synopsis

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

✦ Table of Contents

Front Matter....Pages i-xvi
3D Integration Technologies: An Overview....Pages 1-26
Advanced Bonding/Joining Techniques....Pages 27-90
Advanced Chip-to-Substrate Connections....Pages 91-129
Advanced Wire Bonding Technology: Materials, Methods, and Testing....Pages 131-198
Lead-Free Soldering....Pages 199-236
Thin Die Fabrication and Applications to Wafer Level System Integration....Pages 237-285
Advanced Substrates: A Materials and Processing Perspective....Pages 287-329
Flip-Chip Underfill: Materials, Process, and Reliability....Pages 331-371
New Development Trend of Epoxy Molding Compound for Encapsulating Semiconductor Chips....Pages 373-419
Electrically Conductive Adhesives (ECAs)....Pages 421-468
Die Attach Adhesives and Films....Pages 469-510
Thermal Interface Materials....Pages 511-535
Embedded Passives....Pages 537-588
Advanced Bonding Technology Based on Nano- and Micro-metal Pastes....Pages 589-626
Wafer Level Chip Scale Packaging....Pages 627-695
Microelectromechanical Systems and Packaging....Pages 697-731
LED Die Bonding....Pages 733-766
Medical Electronics Design, Manufacturing, and Reliability....Pages 767-811
Flexible and Printed Electronics....Pages 813-854
Silicon Solar Cell Metallization Pastes....Pages 855-877
Nano-metal-Assisted Chemical Etching for Fabricating Semiconductor and Optoelectronic Devices....Pages 879-922
Characterization of Copper Diffusion in Through Silicon Vias....Pages 923-951
Back Matter....Pages 953-969

✦ Subjects

Electronics and Microelectronics, Instrumentation;Nanotechnology and Microengineering;Metallic Materials;Optical and Electronic Materials;Circuits and Systems