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MARS-a multilevel full-chip gridless routing system

โœ Scribed by Cong, J.; Jie Fang; Min Xie; Yan Zhang

Book ID
117907300
Publisher
IEEE
Year
2005
Tongue
English
Weight
891 KB
Volume
24
Category
Article
ISSN
0278-0070

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[ACM Press the 43rd annual conference - San Francisco, CA, USA (2006.07.24-2006.07.28)] Proceedings of the 43rd annual conference on Design automation - DAC '06 - Novel full-chip gridless routing considering double-via insertion
โœ Chen, Huang-Yu; Chiang, Mei-Fang; Chang, Yao-Wen; Chen, Lumdo; Han, Brian ๐Ÿ“‚ Article ๐Ÿ“… 2006 ๐Ÿ› ACM Press โš– 863 KB

As the technology node advances into the nanometer era, via-open defects are one of the dominant failures. To improve via yield and reliability, redundant-via insertion is a highly recommended technique proposed by foundries. Traditionally, double-via insertion is performed at the post-layout stage.