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[ACM Press the 43rd annual conference - San Francisco, CA, USA (2006.07.24-2006.07.28)] Proceedings of the 43rd annual conference on Design automation - DAC '06 - Novel full-chip gridless routing considering double-via insertion

โœ Scribed by Chen, Huang-Yu; Chiang, Mei-Fang; Chang, Yao-Wen; Chen, Lumdo; Han, Brian

Book ID
121715323
Publisher
ACM Press
Year
2006
Weight
863 KB
Category
Article
ISBN-13
9781595933812

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[ACM Press the 43rd annual conference -
[ACM Press the 43rd annual conference - San Francisco, CA, USA (2006.07.24-2006.07.28)] Proceedings of the 43rd annual conference on Design automation - DAC '06 - Novel full-chip gridless routing considering double-via insertion
โœ Chen, Huang-Yu; Chiang, Mei-Fang; Chang, Yao-Wen; Chen, Lumdo; Han, Brian ๐Ÿ“‚ Article ๐Ÿ“… 2006 ๐Ÿ› ACM Press โš– 863 KB

As the technology node advances into the nanometer era, via-open defects are one of the dominant failures. To improve via yield and reliability, redundant-via insertion is a highly recommended technique proposed by foundries. Traditionally, double-via insertion is performed at the post-layout stage.