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Low-temperature dry etching of copper using a new chemical approach

✍ Scribed by Th. Kruck; M. Schober

Book ID: 114155662
Publisher: Elsevier Science
Year: 1997
Tongue: English
Weight: 283 KB
Volume: 37-38
Category: Article
ISSN: 0167-9317
DOI: 10.1016/s0167-9317(97)00102-0

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