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Low dielectric constant materials for advanced interconnects

✍ Scribed by Michael Morgen; Jie-Hua Zhao; Chuan Hu; Taiheui Cho; Paul S. Ho; E. Todd


Book ID
107525044
Publisher
The Minerals, Metals & Materials Society
Year
1999
Tongue
English
Weight
237 KB
Volume
51
Category
Article
ISSN
1047-4838

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Low dielectric constant materials for in
✍ H. Treichel; G. Ruhl; P. Ansmann; R. WΓΌrl; Ch. MΓΌller; M. Dietlmeier πŸ“‚ Article πŸ“… 1998 πŸ› Elsevier Science 🌐 English βš– 752 KB

The more advanced an integrated circuit becomes, the more stringent are the demands for certain properties of a dielectric or insulating material. In addition, it is essential that the layer maintain its specific electrical, physical and chemical properties after incorporation in the device structur