𝔖 Bobbio Scriptorium

✦ LIBER ✦

Liquid cooling performance for a 3D multichip module and miniature heat sink : MARLIN R. VOGEL. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, 18(1), 68 (March 1995)

Publisher: Elsevier Science
Year: 1996
Tongue: English
Weight: 114 KB
Volume: 36
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(96)84446-5

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