Substrate thickness optimization for liquid immersion cooled silicon multichip modules : MEHDI AZIMI and RICHARD C. JAEGER. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(1), 144 (February 1995)

• Publisher: Elsevier Science
• Year: 1996
• Tongue: English
• Weight: 114 KB
• Volume: 36
• Category: Article
• ISSN: 0026-2714
• DOI: 10.1016/0026-2714(96)84444-1