✦ LIBER ✦
Exceptional performance from the development qualification and implementation of a silicone adhesive for bonding heatsinks to semiconductor packages' : STEPHEN BOSWORTH, SHIH C. HSU and JOSEPH POLCARI. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part A, 18(1), 94 (March 1995)
- Publisher
- Elsevier Science
- Year
- 1996
- Tongue
- English
- Weight
- 118 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0026-2714
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