✦ LIBER ✦
A novel active area bumped flip chip technology for convergent heat transfer from gallium arsenide power devices : DEBABRATA ‘DEV’ GUPTA. IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part A, 18(1), 82 (March 1995)
- Publisher
- Elsevier Science
- Year
- 1996
- Tongue
- English
- Weight
- 229 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0026-2714
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