Lead Free Solder: Mechanics and Reliability

✍ Scribed by John Hock Lye Pang (auth.)

• Publisher: Springer-Verlag New York
• Year: 2012
• Tongue: English
• Leaves: 186
• Edition: 1
• Category: Library

✦ Synopsis

Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free Solder: Mechanics and Reliability provides in-depth design knowledge on lead-free solder elastic-plastic-creep and strain-rate dependent deformation behavior and its application in failure assessment of solder joint reliability. It includes coverage of advanced mechanics of materials theory and experiments, mechanical properties of solder and solder joint specimens, constitutive models for solder deformation behavior; numerical modeling and simulation of solder joint failure subject to thermal cycling, mechanical bending fatigue, vibration fatigue and board-level drop impact tests.

✦ Table of Contents

Front Matter....Pages i-x
Introduction....Pages 1-5
Theory on Mechanics of Solder Materials....Pages 7-22
Mechanical Properties and Constitutive Models....Pages 23-48
Fatigue Life Prediction Models....Pages 49-63
Finite Element Analysis and Design-for-Reliability....Pages 65-88
Thermo-Mechanical Reliability Test and Analysis....Pages 89-122
Dynamic Mechanical Reliability Test and Analysis....Pages 123-153
Thermal Cycling Aging Effects on Board-Level Drop Test Result....Pages 155-170
Back Matter....Pages 171-175

✦ Subjects

Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Continuum Mechanics and Mechanics of Materials; Circuits and Systems