Lead-free Solder Interconnect Reliabilit
β Dongkai Shangguan
π Library
π
2005
π English
β¦ LIBER β¦
π
Lead-Free Solders: Materials Reliability for Electronics
β Scribed by Arthur Willoughby, Peter Capper, Safa Kasap(eds.)
- Tongue
- English
- Leaves
- 497
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- Library
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β¦ Synopsis
Content:
Chapter 1 Reliability of Lead?Free Electronic Solder Interconnects: Roles of Material and Service Parameters (pages 1β9): K. N. Subramanian
Chapter 2 Phase Diagrams and Their Applications in Pb?Free Soldering (pages 11β44): Sinn?Wen Chen, Wojciech Gierlotka, Hsin?Jay Wu and Shih?Kang Lin
Chapter 3 Phase Diagrams and Alloy Development (pages 45β70): Alan Dinsdale, Andy Watson, Ales Kroupa, Jan Vrestal, Adela Zemanova and Pavel Broz
Chapter 4 Interaction of Sn?Based Solders with Ni(P) Substrates: Phase Equilibria and Thermochemistry (pages 71β118): Clemens Schmetterer, Rajesh Ganesan and Herbert Ipser
Chapter 5 βEffects of Minor Alloying Additions on the Properties and Reliability of Pb?Free Solders and Jointsβ (pages 119β159): Sung K. Kang
Chapter 6 Development and Characterization of Nano?Composite Solder (pages 161β177): Johan Liu, Si Chen and Lilei Ye
Chapter 7 Chemical Changes for Lead?Free Soldering and Their Effect on Reliability (pages 179β194): Laura J. Turbini
Chapter 8 Influence of Microstructure on Creep and High Strain Rate Fracture of Sn?Ag?Based Solder Joints (pages 195β231): P. Kumar, Z. Huang, I. Dutta, G. Subbarayan and R. Mahajan
Chapter 9 Microstructure and Thermomechanical Behavior Pb?Free Solders (pages 233β250): D. R. Frear
Chapter 10 Electromechanical Coupling in Sn?Rich Solder Interconnects (pages 251β271): Q. S. Zhu, H. Y. Liu, L. Zhang, Q. L. Zeng, Z. G. Wang and J. K. Shang
Chapter 11 Effect of Temperature?Dependent Deformation Characteristics on Thermomechanical Fatigue Reliability of Eutectic Sn?Ag Solder Joints (pages 273β295): Andre Lee, Deep Choudhuri and K. N. Subramanian
Chapter 12 Sn Whiskers: Causes, Mechanisms and Mitigation Strategies (pages 297β321): Nitin Jadhav and Eric Chason
Chapter 13 Tin Whiskers (pages 323β335): Katsuaki Suganuma
Chapter 14 Electromigration Reliability of Pb?Free Solder Joints (pages 337β373): Seung?Hyun Chae, Yiwei Wang and Paul S. Ho
Chapter 15 Electromigration in Pb?Free Solder Joints in Electronic Packaging (pages 375β399): Chih Chen, Shih?Wei Liang, Yuan?Wei Chang, Hsiang?Yao Hsiao, Jung Kyu Han and K. N. Tu
Chapter 16 Effects of Electromigration on Electronic Solder Joints (pages 401β422): Sinn?Wen Chen, Chih?Ming Chen, Chao?Hong Wang and Chia?Ming Hsu
Chapter 17 Thermomigration in SnPb and Pb?Free Flip?Chip Solder Joints (pages 423β442): Tian Tian, K. N. Tu, Hsiao?Yun Chen, Hsiang?Yao Hsiao and Chih Chen
Chapter 18 Influence of Miniaturization on Mechanical Reliability of Lead?Free Solder Interconnects (pages 443β485): Golta Khatibi, Herbert Ipser, Martin Lederer and Brigitte Weiss
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