Assembly and Reliability of Lead-Free Solder Joints

✍ Scribed by John H. Lau, Ning-Cheng Lee

• Publisher: Springer Singapore;Springer
• Year: 2020
• Tongue: English
• Leaves: 545
• Edition: 1st ed.
• Category: Library

✦ Synopsis

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

✦ Table of Contents

Front Matter ....Pages i-xxi
Solder Joints in PCB Assembly and Semiconductor Packaging (John H. Lau, Ning-Cheng Lee)....Pages 1-62
Prevailing Lead-Free Materials (John H. Lau, Ning-Cheng Lee)....Pages 63-136
Soldering Processes (John H. Lau, Ning-Cheng Lee)....Pages 137-216
Advanced Specialty Flux Design (John H. Lau, Ning-Cheng Lee)....Pages 217-298
Solder Joint Characterization (John H. Lau, Ning-Cheng Lee)....Pages 299-354
Reliability Tests and Data Analyses of Solder Joints (John H. Lau, Ning-Cheng Lee)....Pages 355-413
Design for Reliability of Solder Joints (John H. Lau, Ning-Cheng Lee)....Pages 415-483
Failure Analysis of Solder Joints (John H. Lau, Ning-Cheng Lee)....Pages 485-520
Back Matter ....Pages 521-527

✦ Subjects

Engineering; Electronics and Microelectronics, Instrumentation; Circuits and Systems