Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

✍ Scribed by Karl J. Puttlitz, Kathleen A. Stalter

• Publisher: CRC Press
• Year: 2004
• Tongue: English
• Leaves: 1044
• Series: Dekker Mechanical Engineering
• Edition: 1
• Category: Library

✦ Synopsis

A complete walk-through of the conversion from standard lead–tin to lead-free solder microelectronic assemblies for low-end and high-end applications, this timely reference analyzes the health risks associated with lead; estimates the environmental benefits of using lead-free substitutes in microelectronics; summarizes new regulations, legislation, and marketplace trends affecting the industry; and outlines changes and challenges on the materials, equipment, and process levels for manufacture of lead-free microelectronics.

✦ Table of Contents

Preface......Page 9
Contents......Page 13
CONTRIBUTORS......Page 17
Overview of Lead-Free Solder Issues Including Selection......Page 19
Health and Environmental Effects of Lead and Other Commonly Used Elements in Microelectronics......Page 67
Environmental Impact of Lead and Alternatives in Electronics......Page 101
Environmental Stewardship with Regional Perspectives and Drivers of the Lead-free Issue......Page 133
Market, Product, and Corporate Policy Trends......Page 167
The Metallurgical Aspects, Properties, and Applications of Solders from the Lead–Tin System......Page 185
Physical Basis for Mechanical Properties of Solders......Page 229
Sn–Ag and Sn–Ag–X Solders and Properties......Page 257
Bi–Sn, Sn–Sb, Sn–Cu, Sn–Zn, and Sn–In Solder-Based Systems and Their Properties......Page 299
High-Temperature Lead-Free Solders with Dispersoids......Page 319
Solder Wetting and Spreading......Page 349
Lead-Free Finishes for Printed Circuit Boards and Components......Page 449
Formation of Intermetallic Compounds at Pb–Sn/Metal and Lead-Free/Metal Interfaces in Solder Joints......Page 483
Electronics Assembly and the Impact of Lead-Free Materials......Page 513
Use of Inert Atmospheres in Lead-Free Soldering......Page 587
Pb-Free Component Conversion and Some Manufacturing Experiences......Page 609
Major International Lead (Pb)-Free Solder Studies......Page 683
Electrically Conductive Adhesives—A Lead-Free Alternative......Page 747
Reliability Aspects of Lead-Free Solders in Electronic Assemblies......Page 787
The Physics and Materials Science of Electromigration and Thermomigration in Solders......Page 845
The Structure and Kinetics of Tin-Whisker Formation and Growth on High Tin Content Finishes......Page 869
Degradation Phenomena......Page 933
INDEX......Page 997
Biographies......Page 1033