Content: Wetting behavior of solders / G. Kumar, K. Narayan Prabhu --
A review of Pb-free High-temperature solders for power-semiconductor devices; Bi-base composite solder and Zn-Al-base solders / Y. Takakul, I. Ohnuma, Y. Yamada, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, K. Ishida --
Wetting behavior and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures / S. Narayan, K. Narayan Prabhu --
Solders joint reliability of SnBi finished TSOPs with Alloy 42 lead-frame under temperature cycling / W. Wang, M. Osterman, D. Das, M. Pecht --
The microstructural aspect of the ductile-to-brittle transition of tin-based lead-free solders / K. Lambrinou, W. Engelmaier --
Loading mixity on the interfacial failure mode in lead-free solder joint / F. Gao, J. Jing, F.Z, Liang, R.L. Williams, J. Qu --
Ball grid array lead-free solder joint strength under monotonic flexural load / P. Geng --
Tensile properties of Sn-10Sb-5Cu high temperature lead free solder / Q. Zeng, J. Guo, X. Gu, Q. Zhu, X. Liu --
Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications / S. Mallik, N.N. Ekere, R. Bhatti --
Rheological characterization and empirical modeling of lead-free solder pastes and isotropic conductive adhesive (ICA) pastes / R. Durairaj, L.W. Man, S. Ramesh.
Abstract: "Eleven peer-reviewed papers address the environmental and health concerns related to the exposure to lead during soldering and the success and failures of lead-free solders. Topics cover: Factors affecting the wetting behavior of solders and evolution of interfacial microstructure ; Pb-free high temperature solders for power semiconductor devices ; Effect of surface roughness on wetting behavior and evolution of microstructure of two lead free solders on copper substrates ; Fatigue life of SnBi Finished thin-small-outline-package (TSOP) parts under thermal cycling ; Microstructural aspects of the ductile-to-brittle transition ; Loading mixity on the interfacial failure mode in lead-free solder joint ; Solder joint strengths of BGA (Ball Grid Array) lead-free to that of eutectic lead (Sn-Pb) solder joint strengths. ; Effect of the morphology of Cu6Sn5 intermetallic compound on tensile properties of bulk solder and solder joint ; Tensile properties of Sn-10Sb-5Cu high temperature lead free solder ; Empirical modeling and rheological characterization of solder pastes used in electronic assemblies. STP 1530 is a valuable resource for students, researchers, and material scientists in the electronic industry."--Publisher's website