<p><p>Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-fr
A Guide to Lead-free Solders: Physical Metallurgy and Reliability
โ Scribed by John W. Evans PhD (auth.), Werner Engelmaier Dipl.-Ing. (eds.)
- Publisher
- Springer-Verlag London
- Year
- 2007
- Tongue
- English
- Leaves
- 211
- Edition
- 1
- Category
- Library
No coin nor oath required. For personal study only.
โฆ Synopsis
While tin/lead solders have dominated the electronics industry for many years, environmental considerations and new legislation are forcing change. Backed by more than ten years of research in Pb-free solders, many electronics manufacturers are poised for conversion.
A Guide to Lead-free Solders is intended as a tool to help industry as it moves into a new era in the production and use of solders. An overview of the principles of soldering technology is provided beginning with the theory underlying each concept. Focusing on the most up-to-date methods for testing and characterization, these theories are then reinforced by experimental examples and industrial applications.
โข Addresses key issues in assembly from a materials point of view.
โข Gives the reader convenient access to data essential for the proper evaluation and employment of cutting-edge ternary Sn/Ag/X solders
โข Allows comparison of the performance of Pb-free solders with that of standard eutectic SnPb.
Although primarily of interest to professional design and reliability engineers working in electronics assembly and manufacturing, A Guide to Lead-free Solders will also be valuable for graduate students looking to apply expertise in materials, mechanical or electronic engineering in this industry. Researchers in electronics and materials will find the latest research at their fingertips together with the likely directions industry will need from such research in the future.
โฆ Table of Contents
Front Matter....Pages i-xiv
Introduction to Solder Alloys and Their Properties....Pages 1-27
Packaging Architecture and Assembly Technology....Pages 29-51
Wetting and Joint Formation....Pages 53-78
Microstructural Instability in Solders....Pages 79-95
Intermetallic Formation and Growth....Pages 97-126
Mechanical Properties and Creep Behavior....Pages 127-143
Thermomechanical Fatigue....Pages 145-185
Product Assurance....Pages 187-202
Back Matter....Pages 203-206
โฆ Subjects
Electronics and Microelectronics, Instrumentation; Metallic Materials; Optical and Electronic Materials; Quality Control, Reliability, Safety and Risk; Mechanical Engineering; Manufacturing, Machines, Tools
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