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Kirkendall voids in the intermetallic layers of solder joints in MEMS

✍ Scribed by Kerstin Weinberg; Thomas Böhme; Wolfgang H. Müller


Book ID
116375279
Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
311 KB
Volume
45
Category
Article
ISSN
0927-0256

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