✦ LIBER ✦
Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging
✍ Scribed by Shang, P.J.; Liu, Z.Q.; Li, D.X.; Shang, J.K.
- Book ID
- 127076891
- Publisher
- Taylor and Francis Group
- Year
- 2011
- Tongue
- English
- Weight
- 759 KB
- Volume
- 91
- Category
- Article
- ISSN
- 0950-0839
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